Lead frames are produced by stamping and photochemical etching, which one is more cost-effective?

Lead frames are widely utilized in the semiconductor devices, electrical devices, and circuit boards, lead frame designs are complex and changing the specifications and features all the time.

The advantages of photochemical etching and stamping as below:

Photochemical etching, Without any cost for tooling, High time-efficient, Low expansion rate Design, optimization without financial penalty, Low-risk entry strategy, Easy product design updating Exacting tolerance Finer details, without scratches and burrs. Stamping, Automated with high-speed Low-cost unit price for large production On the whole, for the low to medium volume production with exacting tolerance, photochemical etching is the best choice, if the lead frame that you are looking for is easy and high large volume production, stamping will be more cost-effective.

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