Custom Lead Frame

TMN's lead frame solutions are perfect for the fast-moving electronics industry. They provide a cost-effective and efficient way to make precise lead frames needed for super-small connections and lots of pins. Our method beats traditional stamping hands down!

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Learn about Lead Frames

Lead frames play a pivotal role in the realm of semiconductor manufacturing, serving as the backbone for various electronic devices. These intricate structures facilitate crucial functions, including establishing electrical connections, providing mechanical stability, and optimizing thermal performance.

In the intricate world of semiconductor manufacturing, these frames are indispensable. These intricate structures serve as the backbone for various electronic devices, enabling essential functions such as establishing electrical connections, providing mechanical stability, and optimizing thermal performance. Through precise design and construction, lead frames ensure the seamless operation of integrated circuits, LEDs, and semiconductor sensors, powering the modern electronic landscape. Dive into the core of semiconductor technology and uncover the significance of lead frames in shaping our electronic devices.

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Chemically Etched Lead Frames

TMN's chemical etching process can perfectly meet your needs for these frames.

Our chemical etching advantages

High Lead Density

Enables designs with densely packed leads, increasing functional density within the same footprint.

High Conductivity

Exhibits excellent conductivity, meeting the demands of electronic devices and circuits.

Precision and Fine Tolerances

Achieves high precision machining with ultrafine tolerance control, ensuring adherence to design specifications.

Smooth, Clean Surface

Surfaces are burr-free and stress-free, enhancing device reliability and stability.

Economical Tooling

Low tooling costs and flexibility in structural design cater to diverse device requirements.

Rapid Prototyping

Allows for quick prototyping without costly tooling, reducing production time and expenses.

Surface Treatment Options

Offers various surface treatments such as silver plating, nickel plating, etc., improving device appearance and performance.

Customized Solutions

Adaptable to complex designs, providing tailored solutions for specific needs.

Precision up to ±0.020mm

Maintains high machining precision for accurate results.

Cost-Effective

Reduces production costs while enhancing efficiency, making it an economically viable option.

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Common metal grades

Materials Suitable for Chemical Etching

Material	Characteristics	Material Grade
Beryllium Copper	High etchability, good conductivity	C17200 (Beryllium Copper)
Brass	Etchable, copper-zinc alloy	CZ108 (Brass)
Phosphor Bronze	Good etchability, excellent mechanical properties	C51000 (Phosphor Bronze)
Stainless Steel	Etchable with specific etchants, corrosion resistant	304 (Stainless Steel), 316 (Stainless Steel)
Nickel Silver	Etchable, alloy of copper, nickel, and zinc	C7521 (Nickel Silver)

Materials Not Suitable for Chemical Etching

Material	Characteristics	Material Grade
Silver	Resistant to common etchants, may require specialty	Ag999 (Pure Silver)
Steel	Not typically suitable for chemical etching	Carbon Steel, Stainless Steel (e.g., 430)

Applications

The semiconductor industry stands out as the most widely used field for lead frames. Lead frames are integral to the packaging and assembly of integrated circuits (ICs), which are fundamental components in a vast array of electronic devices across numerous sectors.

Within the semiconductor industry, lead frames are extensively utilized in applications such as: