Custom Board Level RFI Shielding

Custom Board Level RFI Shielding

Custom Board Level RFI Shielding

In modern electronics, the increasing complexity and miniaturization of printed circuit boards (PCBs) have made them more susceptible to radio frequency interference (RFI). At the board level, even minor interference can lead to major disruptions—impacting signal integrity, causing data errors, or leading to complete system failure. To ensure peak performance, compliance, and reliability, custom board-level RFI shielding is essential.

TMN Metal Parts Fabrications specializes in designing and manufacturing custom board-level shielding solutions that provide reliable protection against RFI while maintaining the design flexibility that today’s compact electronics demand.

What is Board-Level RFI Shielding?

Board-level RFI shielding refers to metallic shielding components—such as cans, covers, or enclosures—mounted directly onto the printed circuit board. These shields are designed to contain and isolate high-frequency signals, prevent cross-talk between components, and protect sensitive circuits from external interference.

Unlike enclosure-level shielding, which covers the entire device, board-level shielding targets interference at the source, offering more efficient and localized protection. This approach is ideal for devices where space is limited or where multiple components on a single board require individual shielding.

Why Choose Custom Shielding?

Standard RFI shields often fall short when it comes to meeting the demands of complex PCB layouts or space-constrained designs. Custom board-level shielding from TMN offers several advantages:

  • Tailored fit to your PCB design, ensuring proper alignment and contact

  • Optimized performance for specific frequency ranges and interference profiles

  • Lightweight, compact solutions that do not compromise space or weight requirements

  • Scalability, from prototyping to full-scale production

  • Design flexibility, including removable covers, multi-cavity designs, and thermal vents

With custom solutions, you get the right material, thickness, and geometry to balance performance, manufacturability, and cost.

Our Custom Board-Level RFI Shielding Capabilities

At TMN Metal Parts Fabrications, we offer a comprehensive range of services to meet your board-level shielding needs—from design support to high-volume production. Our capabilities include:

1. Shield Can Fabrication

We manufacture high-precision RFI shield cans in single-piece or two-piece designs (cover + frame). These can be surface-mounted or through-hole soldered to the PCB.

  • Materials: Tin-plated steel, stainless steel, copper alloys, nickel silver, and more

  • Thicknesses: From 0.10 mm to 1.0 mm depending on shielding and mechanical needs

  • Features: Ventilation slots, removable lids, test point access, EMI gaskets

2. Multi-Cavity Shielding

For PCBs with multiple components or circuits requiring individual isolation, we fabricate multi-cavity shields that divide the shield can into several isolated compartments.

  • Reduced footprint compared to multiple individual shields

  • Maintains high shielding effectiveness for multiple zones

3. Surface-Mount Shielding

We design surface-mount-compatible shields that are ideal for automated assembly using pick-and-place and reflow soldering processes. These shields are flat, low-profile, and reworkable.

  • Tape and reel packaging for SMT processes

  • Detachable or peel-back lids for easy debugging and maintenance

4. Snap-On and Clip-On Shielding

We produce clip-mounted shields that snap into place without soldering, allowing for easy removal and reinstallation.

  • Ideal for serviceable electronics or development platforms

  • Available with custom spring clips or tabs for secure fit

Engineering Support and Custom Design Process

At TMN, our experienced engineering team collaborates closely with your design engineers to ensure that every shield we produce aligns perfectly with your board layout and performance needs.

Our Process Includes:

  1. Concept Review

    • Understanding your board design, component layout, and interference sources

  2. Material & Design Selection

    • Choosing appropriate metal types, wall height, wall thickness, and vent patterns

  3. Prototype Development

    • Rapid prototyping to validate fit, function, and performance

  4. Testing & Validation

    • Support with in-house or third-party EMI/RFI testing to ensure shielding effectiveness

  5. Production & Quality Assurance

    • Scalable production with strict quality control to ensure consistent results

With fast turnaround times and design feedback at every stage, TMN helps you reduce design cycles and accelerate time-to-market.

Materials and Finishes

Choosing the right material is key to achieving effective RFI shielding. At TMN, we offer a variety of shielding metals and finishes to meet both electrical and environmental requirements:

Material Properties Applications
Tin-Plated Steel Cost-effective, solderable General electronics
Nickel Silver High conductivity, corrosion resistant RF, medical, telecom
Stainless Steel Durable, corrosion resistant Harsh environments
Copper Alloy Excellent conductivity High-frequency shielding
Aluminum Lightweight, strong Aerospace, automotive

Finishing Options:

  • Tin plating (RoHS compliant)

  • Nickel or silver plating

  • Chemical conversion coatings

  • Passivation

Applications of Custom Board-Level RFI Shields

Our board-level shielding products are used in a wide array of industries, including:

➤ Consumer Electronics

From smartphones to smartwatches, compact devices need effective shielding in the smallest possible footprint. TMN provides miniaturized shield cans with tight tolerances for high-density boards.

➤ Telecommunications

Wireless modules, RF transceivers, and routers all require precision shielding to avoid signal degradation. Our custom designs ensure optimal performance for 5G, LTE, and IoT devices.

➤ Automotive Electronics

In-vehicle infotainment systems, advanced driver-assistance systems (ADAS), and electric vehicle control units demand robust shielding solutions that can withstand vibration, heat, and EMI.

➤ Medical Devices

Sensitive electronics used in diagnostics, imaging, and wearables require shields that comply with medical-grade standards and maintain high signal integrity.

➤ Industrial and Defense

Control systems, sensors, and communication devices in industrial or military environments must perform flawlessly despite high interference levels—our rugged shields are built to meet that challenge.

Quality and Compliance

At TMN, we adhere to the highest quality and regulatory standards in our fabrication processes. Our facilities are equipped with precision tools and inspection systems to ensure your custom shields meet all your specifications.

  • RoHS and REACH compliance

  • ISO-certified processes

  • In-process and final inspection

  • Detailed documentation for traceability

  • Consistent lot-to-lot performance

Why TMN for Board-Level Shielding?

✔ Expertise in Custom Fabrication

We specialize in small, intricate, and high-precision parts for modern PCB applications.

✔ Full-Service Partner

From design consultation to volume manufacturing, we support your entire project lifecycle.

✔ Fast Turnarounds

Rapid prototyping and efficient production processes help meet aggressive project timelines.

✔ Competitive Pricing

Our cost-optimized solutions offer excellent performance without compromising budget constraints.

Contact TMN for a Custom Shielding Quote

If you’re looking for reliable, high-performance custom board-level RFI shielding, TMN Metal Parts Fabrications is ready to help. Whether you’re in the early stages of design or ready for production, we provide solutions tailored to your technical and business needs.

Get in touch today for a consultation or quote. Let’s build the perfect shield—together.

 

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